IEEE Santa Clara Valley CPMT Society Chapter

"ITRS and iNEMI Roadmaps: Changes in Packaging Materials and Architectures for 2012" -- Bill Bottoms, Chair, Technical Working Group for Packaging and Package Substrates, iNEMI (International Electronics Manufacturing Initiative)

WEDNESDAY, May 9, 2012

• Buffet dinner served at 6:00 PM ($20 if reserved by May 7); $10 for fulltime students and currently unemployed engineers; $5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      The primary objective of technology roadmaps has been to define in advance the difficult challenges or roadblocks that could limit or stop progress in the future. Topics that are changing rapidly and pose difficult challenges identified in the 2012 Roadmaps include:

  • 2.5 D Interposer technology
  • 3D-TSV integration
  • New materials to meet thermal/mechanical/electrical and chemical property requirements
  • Packaging requirements for photonic devices: emitters and absorbers of photons; photonic data communication components
  • New power devices (based on compound/ direct band gap semiconductors)

      The difficult challenges and potential solutions in today's version of these Roadmaps will be discussed for these emerging packaging technologies.

  Speaker Biography:
  

      Dr. Wilmer R. (Bill) Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969. As a faculty member in the department of electrical engineering at Princeton University, he was focused on the physics of semiconductor devices.
      Following his work in Academia he worked in industry, joining Varian Associates as Manager of Research and Development in 1976. In 1981, Dr. Bottoms was the founding President of the Semiconductor Equipment Group of Varian Associates. He was also the founder and Chairman of the Board of a Japanese subsidiary of Varian.
      Dr. Bottoms has participated in the start-up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies both directly and indirectly related to semiconductor. Among these companies are:

  • Microelectronics Packaging Inc.
  • Credence Systems
  • Third Millennium Test Solutions
  • Tessera
  • SBA Materials

      Dr. Bottoms has been appointed to a number of government and industry committees and advisory positions. He currently serves as:

  Member of the Board of Tulane University and the Chairman of its Academic Affairs Committee

  Chairman of the Technical Working Group for Assembly and Packaging for the International Technology Roadmap for Semiconductors (ITRS)

  Chairman of the Technical Working Group for Packaging and Package Substrates for the International Electronics Manufacturing Initiative (iNEMI)

  Chairman of the Semiconductor Equipment and Materials Institute (SEMI) Awards Committee

  
  

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