IEEE Santa Clara Valley CPMT Society Chapter

"Pad Cratering, Lead Free and Density Challenges Facing the Electronics Packaging Industry" -- Chris Hunrath, Vice President of Technology, Integral Technology

WEDNESDAY, October 10, 2012

• Buffet dinner served at 6:00 PM ($20 if reserved by Oct 8) ; $10 for fulltime students and currently unemployed engineers
  ($5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      High-density electronics continues to increase demands on Printed Circuit board materials and constructions. Added to that, the use of lead-free solder at higher assembly temperatures can impart latent mechanical stresses and at the same time embrittle the PCB material. Furthermore, increasing field performance requirements (such as for mobile devices) increase the need for better mechanical reliability. Density, thermal and mechanical pressures have increased the incidence of "Pad Cratering," a fracture defect found most commonly on BGA assemblies and leads to opens.
      New film-based materials and combinations of materials create opportunities for PCB manufacturers to meet these demands. They allow the manufacturer to impart certain properties in specific layers. Indeed, these "laminar composites" will not only enable denser structures, but make them very reliable.

  

  Speaker Biography:
  

      Chris Hunrath is the Vice President of Technology for Integral Technology, a manufacturing corporation focusing on the research and development of new products for emerging technologies. In his 30-year career in the electronics industry, Hunrath has contributed to several breakthrough products including many in the new Zeta product line offered by Integral. He is a recognized expert on pad cratering and HDI.

  
  

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  If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Place yourself on our email distribution list [or send a request to Paul Wesling.]

  
  

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