IEEE Santa Clara Valley CPMT Society Chapter
"Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization"
-- Susan Bagen, Endicott Interconnect Technologies, Inc.
Presentation Slides: "Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization" (1.8 MB PDF)
WEDNESDAY, February 13, 2013
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM
($20 if reserved by Feb 11th) ; $10 for fulltime students and currently unemployed engineers
($5 more at the door;
- Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)
Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the Doubleknot link above.
- Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
- 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
Electronics packaging technologies for today's high reliability markets including high performance computing, military and medical are driving advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP). A key enabling technology towards achieving SWaP is the substrate technology used. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic.
This presentation will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction (CPI) and resulting reliability will be discussed. System-in-Package (SiP) case studies of real product miniaturization resulting in >27x size reduction for military and high performance computing applications will be presented in detail. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications will also be discussed. A Package-Interposer-Package configuration to produce 3D assemblies will also be shown.
- Speaker Biography:
Susan Bagen currently fulfills a dual role as a Business Development Manager and Sr. Field Applications Engineer for Endicott Interconnect Technologies, Inc. where she is focused on high reliability markets including medical and military. She has 25 years experience in the development of microelectronic packaging solutions for military, medical and commercial applications. Prior to EI, Susan was an independent industry consultant for 14 years, and held positions with both Texas Instruments and Dow Chemical. She has a B.S. in Chemical Engineering from Case Western Reserve University. Susan is a licensed professional engineer in the state of Texas. She is a long-time member of technical committees for the International Microelectronics and Packaging Society and the Symposium on Polymers in Microelectronics (IMAPS), and is currently Program Chair for the IEEE EMBS (Engineering in Medicine & Biology Society) Dallas Chapter. She holds 5 U.S patents and has a number of publications.
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