IEEE Santa Clara Valley CPMT Society Chapter

"NanoCopper Materials Platform for Electronics Packaging and Printed Electronics with 200C Processing Temperature" Alfred Zinn, Senior Scientist, Lockheed Martin Space Systems Company ATC

• Buffet dinner served at 6:00 PM ($20 if reserved by June 10th) ; $10 for fulltime students and currently unemployed engineers
  ($5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanocopper-based material that can be fused to bulk copper around 200C taking advantage of the rapidly decreasing fusion temperature with decreasing particle size at the nanoscale. The nanocopper material has the potential to replace tin-based solder to eliminate whisker growth and mechanical reliability concerns encountered with current lead-free solder. Fully optimized, the fused copper is expected to exhibit 10-15x electrical and thermal conductivity improvements over tin-based materials currently in use. The materials platform is enabled by our scalable Cu nanoparticle fabrication process employing a low cost solution-phase chemical reduction approach. A proprietary mixture of surfactants controls particle size and size distribution as well as stabilizing the particles preventing particle growth and oxidation, which would otherwise degrade its activity. We have demonstrated assembly of fully functional LED test boards using a paste formulated with nanocopper that exhibits a consistency very similar to standard tin-based solder paste. To date, we have demonstrated 26-pin through-hole connector assembly and a variety of surface mount components. We demonstrated feasibility of drop-in solder replacement using standard stencil and pick & place packaging equipment as well as demonstrated feasibility of using the material for printed electronics applications.

  Speaker Biography:
  

      Dr. Alfred Zinn received his Doctor of Science degree in Chemistry in 1990 from the Philipps University, Marburg, Germany. Following completion of his graduate studies, Dr. Zinn spent five years at UCLA as a lecturer and conducting postdoctoral research on low-temperature CVD for interconnect, diffusion, and migration barrier deposition, as well as magnetic nanomaterials design and synthesis. In 2004, he joined Lockheed Martin Space Systems Company Advanced Technology Center in Palo Alto, developing high-temperature materials systems, nanostructured functional materials (electrical, thermal, thermoelectric), modeling quantum/superlattice structures and devices, high performance energy conversion devices (solar, high & low quality heat conversion). He holds seven patents in materials, structures and processing, two THz technology patents, with ten additional patents pending (multiple international filings) as well as four trade secrets. He has authored or co-authored over 20 archival journal publications, including book chapters in "The Chemistry of Metal CVD" as well as the "Encyclopedia of Inorganic Chemistry".

  
  

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