IEEE Santa Clara Valley CPMT Society Chapter

"Advanced Package Migration to System-Level Integration"
Curtis Zwenger, Sr. Director, Package Development, Amkor Technology, Inc.

WEDNESDAY, October 9, 2013

• Buffet dinner served at 6:00 PM ($20 if reserved by Oct. 7th) ; $10 for fulltime students and currently unemployed engineers
  ($5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      The tremendous growth in the smartphone, tablet, consumer electronics, and networking markets has been fueled by the end users' demand for increased mobility, functionality, connectivity, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of IC devices, resulting in the need for more complex and integrated packaging techniques. A variety of innovative packaging technologies are addressing this growing need, such as advanced substrates, 2.5D interposers, embedded active die, and package-on-package. This presentation explores how these technologies are enabling the migration from advanced packaging solutions to system-level integration techniques, to meet the current and future needs of the semiconductor packaging industry.

  Speaker Biography:
  

      Curtis Zwenger joined Amkor in 1999 and has held leadership roles in developing Amkor's Fine Pitch Copper Pillar, Through-Mold Via, and MEMS packaging technologies. Currently he is responsible for the development and commercialization of Amkor's panel level fan-out and embedded die product lines. He previously worked at Motorola. Curtis holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

  
  

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