IEEE Santa Clara Valley CPMT Society Chapter

"A New Concept for Lead Frames"
Phil Rogren, EoPlex

Tuesday, April 7, 2015  

• Networking and light dinner ($5) served at 5:45 PM
  
• Presentation (no cost) at 6:30 PM (arrive by 6:15 PM)

  Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.

  You may register yourself, plus others from your company/institution, for both light dinner and presentation, or for only the presentation. YPlease make an on-line payment for the dinner.

PLEASE RESERVE IN ADVANCE --
• For networking/food and/or meeting: at the EventBrite link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:30 PM.
Texas Instruments Building E Conference Center

• 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara -- click map at right.

  OVERVIEW:

      The Quad Flat No-Lead Package (QFN) is growing despite it being a legacy package with leadframe. According Gartner Forecast published last year, QFN volume will grow to 70 Billion units with a $2.9 Billion market value. This makes the QFN the greatest in volume relative to all other types of semiconductor packages. Its popularity is fueled by its lower cost and quick turn-on time. Packaging engineers are looking at ways to miniaturize QFN and to pack more I/O's including EoPlex. EoPlex has developed a leadframe using 3D High Volume Print Forming (3D HVPF) technology and high density sintering of metal powders. The platform is referred to as Configurable Sintered Interconnect (CSI). The first CSI product, called a LeadCarrier, is an enhanced replacement for a QFN leadframe that enables the QFN assembly process to be used with much more complicated semiconductors that would otherwise require QFP or BGA packages. While the LeadCarrier drops into the standard QFN process with very minimal adjustments, it eliminates the leadframe's tie bars and allows for finer features than possible with an etched lead frame. In addition to enabling size reduction and more economical processing for these more sophisticated devices, CSI based packages may also be made as thin as 200u.
      This talk will discuss the structure and properties of CSI based LeadCarrier as well as the reliability and manufacturability characteristics for semiconductor packaging applications.
  

  Speaker Biography:
  

      Phil Rogren has over 40 years of experience in engineering, sales and marketing positions in semiconductor packaging and interconnect. He joined EoPlex in 2005 as VP Sales and Marketing, and assumed responsibility for finding applications for EoPlex's novel High Volume Print Forming (HVPF) technology. In his product development role at EoPlex, he is the creative driver behind the CSI™ lead carrier and author of the CSI patents. Before joining the EoPlex team, Phil served as VP Marketing and Sales at Shellcase, where he was instrumental in adapting the Shellcase wafer level packaging technology as a premier packaging vehicle for CCD and CMOS cameras. Prior to Shellcase, Phil served in management positions in engineering and business development at Nexus, Hestia Technologies, Alcoa Electronic Packaging and Microelectronic Packaging, Inc. Phil holds a B.S. in Ceramic Engineering from the University of Washington.

  
  

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