IEEE/CPMT Lunch Meeting, in the Santa Clara Valley:
FO-WLP - A Disruptive Technology: Drivers and Developments
Presentation Slides: "FO-WLP - A Disruptive Technology: Drivers and Developments" (2 MB PDF)
-- E. Jan Vardaman, TechSearch International, Inc.
Tuesday, February 9, 2016
- Optional lunch provided ($5 for members/students/unemployed, $10 for non-members)
- Registration (and sandwiches/drinks) at 11:30 AM
- Presentation-only (no cost) at 12:00 PM noon (come at 11:45 AM)
- Please reserve by the end of February 7, so we can provide the food.
Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.
You may register yourself, plus others from your company/institution, for this lunch and presentation. Please make an on-line payment for the lunch.
LOCATION: Texas Instruments Building E Conference Center
2900 Semiconductor Dr. (off Kifer Rd), Santa Clara -- click map at right.
Mobile devices, including smartphones, are driving package developments and unit volume growth in the semiconductor industry. Many companies have adopted wafer level packages (WLPs). WLP has seen strong growth, especially for mobile devices, because it provides a low-profile package that meets the low-profile packaging requirements of high-end smartphone makers. The introduction of fan-out WLP (FO-WLP) represents an additional change in the infrastructure. FO-WLP is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP is disruptive technology because there is no substrate and thin-film metallization is used for interconnect instead of bumps or wires. This presentation examines the drivers for FO-WLP and the impact on the existing infrastructure. Applications and market trends are presented. Alternatives to the existing FO-WLP structures are described.
- Speaker Biography:
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987. She is a columnist with Printed Circuit Design & Fab/Circuits Assembly Magazine, is an IEEE CPMT distinguished lecturer, and the author of numerous publications on the microelectronics market and technology trends. She is a member of IEEE CPMT, IMAPS, SMTA, MEPTEC, and SEMI. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry's first pre-competitive research consortium.
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