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    Photonic Systems Changes: Driving Innovation in Photonic Packaging
    -- Dr. W. R. Bottoms, Third Millennium Test Solutions

Tuesday, March 8, 2016

    Photons have been incorporated in or connected to electronic systems for many years. The components were primarily photovoltaics, image sensors and long-range data communications. Component sizes were large and packaging requirements were relatively simple. The emergence of the IoT and migration to the Cloud are dramatically changing this picture. Limitations in physical density of bandwidth, power and cost are driving the need for much more complex integrated photonic subsystems and systems. Physical density of bandwidth can be addressed by single mode photonic connections and Wavelength-Division Multiplexing (WDM) to the package. Power limitations can be addressed by moving photons closer to the transistors. Cost can be addressed by moving system components closer together and increasing parallelism in manufacturing. The changes are driving innovation in packaging with chip and package level heterogeneous integration, panel level processing, and electronic/photonic components in the same SiP. New materials, new processes and new package architectures required will be discussed.

Speaker Biography:
    Dr. Bill Bottoms received his B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures.
    Dr. Bottoms currently serves as:
  • Emeritus Member of the Board of Tulane University
  • Chairman of the Heterogeneous Integration Focus Team for the International Technology Roadmap for Semiconductors
  • Chairman of the Semiconductor Equipment and Materials International's SEMI Awards Committee
  • Chairman of APMT
  • Chairman of Third Millennium Test Solutions

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