IEEE/CPMT Dinner Meeting:
"Packaging for High Speed: the what, how, who and why" --
Dr. Eric Bogatin,
Product Manager, Signal Integrity Products,
Wednesday, November 12, 1997
Subsidized dinner ($10) served at 6:30, Presentation at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP by email to
Harvey Miller, or call
our CPMT hotline at 800-686-9366.
"Packaging engineers are not
often trained in the art of high speed design ..."
Ten years ago, when clock frequencies were 20 MHz, packages were
electrically transparent. It didn't matter what the electrical properties
were. What was important was the mechanical form factor, thermal management
and reliability. Today, with clock frequencies at 200 MHz and higher,
ignoring the electrical effects of packages will doom the designer to
disaster. Switching noise, excessive timing delays, signal distortion,
cross talk and EMI are some of the problems that can sabotage an otherwise
great design. Yet, few engineers today really understand which electrical
terms are important and which can be ignored. Packaging engineers are not
often trained in the art of high speed design, and are left to learn what
they can from the trade journals or the street- often picking up wrong
This evening's presentation will be a step in the right direction. Eric
will offer a quick overview of what is important when it comes to the
electrical behavior of packages, how these effects are described and
calculated, who are the companies that can help the designer starting out,
and why these issues are important. Examples will be taken from leaded
packages, BGAs, CSPs and COB. The essential tools of parasitic extraction,
simulation, measurement and intuition will all be reviewed.
Speaker: Eric Bogatin, Ansoft Corp.
has been active in high speed interconnect and packaging
design for over 17 years, working at AT&T Bell Labs, Raychem, Advanced
Packaging Systems, Sun Microsystems and most recently, Ansoft Corp.
Somewhere in between, he taught numerous short courses on signal integrity
and the high speed design of interconnects, and authored numerous papers
and books. His latest book, published in 1997 by ICE, in Scottsdale, Az, is
Roadmaps of Packaging Technology. Eric is currently the product manager for
signal integrity products with Ansoft Corp.
If you are not on our Chapter's regular email or FAX distribution list
for meeting anouncements, you can easily be added!
Please send an Email to
and let me know if you'd like email or FAX distribution.
If you don't have Email, then please reply to 800 696-9366 (CPMT's 800 number)
or FAX to me at (408) 741-3559, but please be advised that I would greatly
prefer the Email route.
January 21, 1998