Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

Eugene Hnatek, Compaq Computer Corp., Tandem Product Evaluation Center

Wednesday, September 9, 1998
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

No company makes perfect ICs. IC manufacturers must work within the confines of design, processing, packaging, materials, computer modeling and testing limitations, as well as time-to-market and cost considerations. As a result, errors, defects, materials incompatibilities and failure mechanisms exist to some extent in all ICs.

The analysis of today's IC and packaging technologies is based on well developed tools and methods. However, the challenge posed by ICs with more than 1 billion transistors, feature sizes less than 0.2 micron, clock frequencies in excess of 1 GHz and power dissipation approaching 100W requires that new failure analysis techniques be developed. These new methods include greater reliance on die backside methods, software tools for fault isolation, and electrical test diagnosis and localization techniques. There is a critical need not only for rapid improvement of existing diagnosis and failure analysis capabilities but for the implementation of real time analytical techniques not found in conventional production facilities.

This talk provides an overview of the need for and the role of failure analysis in the IC industry and summarizes some of the issues involved and challenges faced in conducting a failure analysis for deep sub-micron ICs as the SIA NTRS becomes a reality.

About the Speaker:
Eugene Hnatek has worked in various aspects of IC fabrication, contamination control, assembly, electrical test, statistical process/parameter monitoring, identification of failure mechanisms, and developing and applying appropriate screening criteria. Before accepting his current assignment as Director of Tandem Computer's Product Evaluation Center, he was manager of Component Engineering at Tandem (now a division of Compaq Computer Corp.). Mr. Hnatek's previous work experience includes assignments at Lockheed Missiles & Space Company, National Semiconductor, Monolithic Memories, Viking Laboratories and Honeywell. He is a member of the technical program committee for the International Test Conference (ITC) and is the 1998 chairman of the Computer Industry Quality Conference (CIQC).

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Rena Ayeras and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

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Revised August 19, 1998