The speakers will present the bumping and packaging of flip chips in both CSPs and BGA packages. Topics discussed will include both standard and redistributed flip chip bumping, and bumping roadmaps. Market drivers, CSP & BGA package constructions, reliability data and discussion of technical issues in package construction will be presented for Flip Chip in package applications. Examples will be shown of both fine pitch and redistributed flip chip bumping as well as several flip chip packages of various constructions.
About the Speakers:
Peter Elenius is the VP of Technology and Chief Technical Officer for Flip Chip Technologies. Flip Chip Technologies is a high volume wafer bumping foundry supporting IC Manufacturers and OEMs. Flip Chip Technologies is a joint venture of Delco Electronics and Kulicke & Soffa Industries.
Prior to joining Flip Chip Technologies, Peter was the Flip Chip Product Manager for Kulicke and Soffa. While there he was responsible for Kulicke and Soffa's flip chip equipment program, including the formation of Flip Chip Technologies.
Mr. Elenius managed flip chip/MCM equipment and process groups at IBM Microelectronics for 13 years. He has been involved with flip chip equipment development, flip chip assembly process technology and wafer level solder bumping for 16 years. He is a graduate of the University of Wisconsin - Madison, where he was awarded a B.S. degree in Mechanical Engineering and a M.S. in Manufacturing Systems.
Patrick O'Brien is Director of Flip Chip Packaging at Amkor Technology, the world's leading IC packaging foundry. Prior to joining Amkor, Patrick was a package development engineer at LSI Logic working on advanced packaging.
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