Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"Flip Chip Developments in CSP and BGA Packages" --
Pat O'Brien, Director of Flip Chip Programs
and Peter Elenius, VP of Technology & CTO for Flip Chip Technologies

PDF version of Slides

Wednesday, October 14, 1998
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

The speakers will present the bumping and packaging of flip chips in both CSPs and BGA packages. Topics discussed will include both standard and redistributed flip chip bumping, and bumping roadmaps. Market drivers, CSP & BGA package constructions, reliability data and discussion of technical issues in package construction will be presented for Flip Chip in package applications. Examples will be shown of both fine pitch and redistributed flip chip bumping as well as several flip chip packages of various constructions.

About the Speakers:
Peter Elenius is the VP of Technology and Chief Technical Officer for Flip Chip Technologies. Flip Chip Technologies is a high volume wafer bumping foundry supporting IC Manufacturers and OEMs. Flip Chip Technologies is a joint venture of Delco Electronics and Kulicke & Soffa Industries.
Prior to joining Flip Chip Technologies, Peter was the Flip Chip Product Manager for Kulicke and Soffa. While there he was responsible for Kulicke and Soffa's flip chip equipment program, including the formation of Flip Chip Technologies.
Mr. Elenius managed flip chip/MCM equipment and process groups at IBM Microelectronics for 13 years. He has been involved with flip chip equipment development, flip chip assembly process technology and wafer level solder bumping for 16 years. He is a graduate of the University of Wisconsin - Madison, where he was awarded a B.S. degree in Mechanical Engineering and a M.S. in Manufacturing Systems.

Patrick O'Brien is Director of Flip Chip Packaging at Amkor Technology, the world's leading IC packaging foundry. Prior to joining Amkor, Patrick was a package development engineer at LSI Logic working on advanced packaging.

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Rena Ayeras and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

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Revised September 2, 1998