OVERVIEW:
CSP poses new Test Challenges and requires innovative test techniques.
In order to fulfill the need for smaller electronics, the semiconductor
industry is pushing the technology to the limit, in search for solutions to
lower the overall cost, and to minimize lead and package damage associated with
handling of a device through the production process.
The assembly portion of the process has found a solution in handling the
product in a Strip format, minimizing handling, lowering cost, improving
Quality and increasing throughput.
After assembly, parts are singulated, and sent for test. The cost of Test
for the wide variety of packages, requiring handlers, Kits, Trays, Tubes,
Multiple handling, and inspections, is becoming a major factor in the total
cost of an IC.
New technologies for Handling and Test should be developed in order to
enable Strip Testing, and gradually diminish the need for singulated Test.
Alignment difficulties for shrinking dimensions and pitches, along with the
need for parallel testing of devices in a strip format, will require
cooperation of multiple vendors providing solutions for both the mechanical
and electrical aspects of test.
Please join us for a presentation and discussion on these pressing issues.
Adi Merschon is the Technical Sales & Marketing Manager, ISE Group.
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Revised
November 2, 1998