"Flip Chip Packaging Assembly Operations at Kyocera America Inc." --
Robert Lanzone, Kyocera America
Robert Lanzone, General Manager Flip Chip Packaging, will give a presentation on
Kyocera America, Inc.'s (KAI) $ 5.7 million investment for thier new automated flip chip subcontract assembly line. KAI has completed construction and equipment installation at this facility located in San Diego. KAI has built a new building -- 6,600 square feet -- to house the flip chip assembly operation in a Class 10,000 clean room. Kyocera America, Inc. is selecting the most advanced high-placement-accuracy and units-per-hour equipment to create an initial capacity of 200,000 pieces per month with a two-shift 5-day workweek operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and some
additional pieces of equipment.
A large number of flip chip substrates are also ball grid arrays, therefore this line will have full capability for advanced ball placement operations down to 0.5 mm pitch. Various ball grid array interconnect styles can be handled, such as D-BGA, C-BGA (90/10 + eutectic), and eutectic solder ball.
A detailed summary of the equipment highlights for the flip chip line will be presented and a synopsis is as follows:
Magazine Handling
The best method for optimizing volume and high mix assembly of flip chip substrates is a magazine based system. Flip chip substrates range in body size O.D.'s from 19 mm square to 56 mm square. An Auer magazine boat system that is on a five up configuration for body sizes up to 35 mm square and four up configuration for larger than 35 mm square has been selected.
Solder Printing and Capacitor Attachment
Many of the products that require flip chip also have a large number of capacitors, (up to 20 or more), that need to be attached to the substrate. To place a large number of capacitors can be a drag on the line productivity, especially if the flip chip mounter is utilized for this process. Therefore it was decided to use an Asymtek dispenser capable of solder deposition for 5 caps at 450 UPH. This equipment offers fully automatic translation and correction with computer-controlled fiducial lighting for individual fiducials.
A Univeral GSMx was chosen for chip capacitor placement. The machine has 4 heads / 2 cameras and is also outfitted with full flip chip capability. This equipment has a +/- 30 um @ 5 sigma placement performance with a placement rate of approximately 900 CPH for flip chip.
Flip Chip Attachment
ESEC's Micron 2 has been chosen for flip chip placement due to it's high accuracy and
throughput. The system has 2 heads / 2 cameras and is equipped with the Print Fluxer system. The Micron 2 uses a laser prealignment system to achieve high throughputs providing placement accuracy of +/- 12 um @ 3 sigma. It also comes with a placement force calibration system. Placement rates of up greater than 1,000 CPH are attainable.
Flip Chip Reflow
An RTC Controlled Atmosphere Infrared Furnace is utilized for chip reflow. Oxygen and moisture sensors ensure tight process control. The furnace is capable of hydrogen and nitrogen operation and controls oxygen content below 5 PPM.
Flip Chip Flux Cleaning
Accel Mirocel2 centrifugal cleaning equipment will be utilized. The Microcel uses centrifugal and coriolis energies within an enclosed chamber. A solvent immerses the spinning parts during the wash cycle. The energy forces the solvent in a direction parallel to the plane of the parts driving it under components with very small clearances and into dead spaces.
Flip Chip Underfill
Asymtek's Millennium series dispenser is utilized for the underfill operation. The Millennium is fully automatic for unassisted in-line IC underfill production. An integrated mass flow calibration system automatically compensates for changes in fluid viscosity. Full temperature control of fluid delivery and substrate temperature maintains proper fluid chemistry during dispensing. The system has a mass flow calibration station and a DP-2000 true positive displacement pump.
Summary
Due to market pressures this first assembly line will be equipped to support ceramic flip chip. Kyocera America, Inc. will accommodate various bump metallurgies and sources. It is anticipated that the majority of bump metallurgy will be high melting point solder such as 97/3, 95/5, & 90/10 Lead / Tin compositions. Eutectic (63 / 37) metallurgies are also anticipated. Kyocera America, Inc. will work with the customer's internal bump or their subcontractor's technologies. Kyocera America, Inc. will be forming strategic partnerships with those key subcontract bump providers.
Revised
November 3, 1998