In this presentation, I explore different aspects of Flip Chip and Chip Scale Packaging technologies. Certain characteristics of these technologies will unquestionably influence their actual implementation in high-volume production, making some architectures more preferable than others.
The materials that will be presented are derived from the positions presented in two published articles entitled "Flip Chip DCA - No Way" and "The Mini BGA Beats the Micro BGA."
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Revised
25 August 1999