SEMI standards cover strip marking and are starting to cover mapping so that an implementer can chose an approach. Implementation using the technology available today allows traceability from a semiconductor in a package to a wafer. With a little more effort, a trace can be made to a location on a wafer. Again, the implementer can chose the level of traceability.
Sagitta's products are based on a proprietary core technology which allows superb process control. Incorporating a unique design of mechanics and optics with dedicated control algorithms, it also combines the latest opto-electronics and advanced image processing algorithms to monitor the sample preparation process with superb accuracy.
NEXT-1, Sagitta's first product, is an automatic cross-sectioning system designed for fast and accurate sample preparation for process monitoring and Failure Analysis (FA) purposes, offering a unique ability of cross-sectioning wafer samples for microstructure analysis (such as SEM, TEM) at a predefined point. Using on-line video microscopy control and precise polishing methods, NEXT-1 provides users with a one-stop sub-micron sample preparation and analysis workstation.
Sagitta Ltd. was founded in January 1995. Corporate headquarters are located in Ramat-Gan, Israel.
A scanning SQUID microscope can overcome some of these difficulties. A SQUID (Superconducting Quantum Interference Device) is a very sensitive magnetic sensor that can image magnetic fields generated by magnetic materials or currents (such as those in an integrated circuit). The current density distribution in the sample can then be calculated from the magnetic field image, and resolutions approaching 5 times the near field limit can be obtained.
Presented here is the application of a SQUID microscope to physical failure analysis. We have investigated shorted current paths on various devices at both package and die levels. The samples have all been imaged nondestructively using low currents. Where possible, the results from the SQUID microscope are compared to the results from deprocessing.
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Revised 24 November 1999