CPMT Technical Committee
on IC and Package Assembly (TC-3)

Microelectronics device and component assembly has continued to advance at an accelerated pace. Wirebonding is still the chip interconnect of choice for most integrated circuits, and new processes, materials and applications keep pushing the envelope of what is possible. This includes using wirebonders for flip chip stud bumping. For many high performance devices, flip chip solder attach has become the connection of choice. As the solder content is moving from high lead C4 type connections to lead free alloys for environmental reasons, the impact of alloy content, processing changes, rework and reliability make the challenges even greater. Further advancements in chip connections include copper columns, and various adhesive attachments (Anisotropic Conductive Film, ACP, NCP) used in concert with the stud bumping process. For many newer devices sensitive to high temperature reflow profiles, such as MEMS, MOEMS and SAW devices, other materials are being explored to use for attachment. To say the least, chip attach challenges and advancements have continue to grow as devices become more exotic.

At the next level package assembly, these challenges do not diminish. Indeed, with higher complexity packages and modules emerging into the market for new applications (wireless, biomedical, defense), the ability to attach these packages increases. From the smallest of passive devices to the largest of processor modules, the challenges range from automated placement accuracy, to cleaning, to stacking to folding. Because device power and power densities continue to increase instead of decrease, additional challenges arise from thermal interface materials used to transfer heat from the source to the sink.

This committee explores new directions and techniques for IC and packaging assembly, from materials, processes, equipment and tools needed to development and support them. There is a cooperation between this Committee and the committees on materials, packaging, thermal management, and standards. This Committee is also supporting the CPMT Transactions on Advanced Packaging.

Associated activities:: 2007 International Electronics Manufacturing Technology Symposium (San Jose, CA), 2007, Call for Papers; 2007 Surface Mount International, (Chicago, IL), Sept. 2007; 2007 IMAPS Conference (San Jose, CA), Nov. 11-15, 2007

For more information, or to join our TC, send an email note or letter to:

Martin Goetz, TC Chair
IBM
3039 Cornwallis Rd.
Research Triangle Park, NC 27709 USA
+1-919-486-2409

(open), TC Vice Chair

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This TC has an open position for a Webmaster or assistant; please contact the chairman, above.

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Last Updated: June 12, 1998 || 

 
Paul Wesling || Send comments to 
Paul Wesling.

CPMT Technical Committee on IC and Package Assembly (TC-3)

CPMT Technical Committee
on IC and Package Assembly (TC-3)