CPMT Technical Commitee
on Power Electronics Packaging (TC-13)
This committee provides a focus for the development of technologies
that are relevent to the electronic processing of power. Nearly all
of the materials, manufacturing and process technologies developed
for application to signal and data processing can be used in power
processing. The committee facilitates the development of packaging
technology specific to power electronics and systems, and maintains
a roadmap for power packaging from chip-level to end-product. It has
been established as a joint committee with the
IEEE Power Electronics
Society.
Coming in July:
International Workshop on Integrated Power Packaging
(IWIPP)
July 14 - 15, 2000 --
Westin Hotel --
Waltham, MA USA
- Associated activities:
Electronic Components and Technology Conference (ECTC)
-
Applied Power Electronics Conference (IEEE-PELS)
-
International Workshop on Integrated Power Packaging (IWIPP)
Help Wanted
You can make an immediate difference in this growing, dynamic yet still
overlooked field. Lend your help by joining the Power Electroncis Packaging Technical
Committee. This can provide you with a network of like-minded
technical professionals for interchange of ideas and developments -- a networking opportunity.
For more information, to join our TC, or to volunteer for a leadership
position in the TC, send an email note or letter to:
Dr. Doug Hopkins, the TC Chair
High Power Electronics Institute
Bonner Hall, Room 312
State University of New York at Buffalo
Buffalo, NY 14260 USA
+1-607-729-9949
FAX: +1-607-729-7129
Anyone can be a participating member of one or more of the CPMT Society's TCs
without belonging to the IEEE; most of our TCs have a mailing list, a newsletter,
and a networking listing.
This TC has an open position for a Webmaster or assistant; please
contact the chairman, above.
Send comments to
Paul Wesling ||
Revised 9 June 2000
