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Welcome to APM 2007!

The Advanced Packaging Materials Symposium (APM 2007) is an international premier technical event on electronic packaging materials organized by the IEEE’s Components Packaging and Manufacturing Technology (CPMT) Society and its Santa Clara Valley Chapter. APM 2007 will feature Keynote talks, technical presentations, and exhibits. The Symposium aims to provide leading-edge coverage of developments in all areas of packaging materials and processes. Attendees in the past have included academic researchers, developers, producers, and users of packaging materials from all over the world. APM is also a major packaging materials forum, providing opportunities to network and meet leading experts and exchange up-to-date packaging knowledge in the field.

Gathering in the relaxed, California atmosphere reminiscent of a campus or retreat center (yet still in the heart of Silicon Valley), we co-locate with the CPMT Society's International Electronics Manufacturing Technology Symposium for several days of learning, networking, and sharing. Attendees pay one conference fee and can build their plans around sessions from both events. A full day of Professional Development Courses supplements the interchanges that are experienced within the conference itself.

Registration is now open -- Download the Advance Program and plan to attend this year's IEMT/APM Symposium!








70th Anniversary

Join our Platinum, Gold and Silver Sponsors and Exhibitors -- visit our Sponsorship Page

Technical Co-Sponsors:

Semiconductor Equipment and Materials International     iNEMI
IEEE LEOS Society, SCV Chapter
  Santa Clara Valley Chapter

APM'07 Officers:

Dr. Dongkai Shangguan, Flextronics, General Chair
Dr. Vasudeva Atluri, Intel Corp, Vice General Chair
Daniel D. Lu, Intel Corp, Vice General Chair
Paul Wang, Microsoft, Program Chair
Prof. Jianmin Qu, Georgia Tech, Vice Program Chair
Paul Wesling, IEEE, Administrative Committee Chair

To be added to our Distribution List for future information on APM'07, please send an email note to us: Paul Wesling.

Sponsored by: IEEE CPMT Society
Corporate Sponsors: