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OVERVIEW:

The continuing advancements in silicon technology are driving further innovation in flip-chip substrate technology. Market dynamics have lead to a de facto standardization of build-up technology for flip chip substrates for CPUs, graphics and gaming processors and ASICs. More advanced substrates like coreless and high density core substrates have been developed but their market penetration has yet to happen. The most aggressive substrate development is now driven by mobile applications seeking to embed components directly into the substrate. Discretes as well as active die can be embedded successfully but market penetration is pending the development of new business models because the supply chain will be changed by these new substrates. Likewise the development of flip chip chip scale substrates is also driven by mobile applications to become a low cost and high volume technology.

In this presentation, the different substrate technologies will be reviewed. The market dynamics of the substrate evolution will be described and opened up for discussion.

Speaker Biography

Bernd Appelt obtained his PhD in Polymer Chemistry at the University of Mainz, Germany. He started his career in the US as a post-doc at the University of Massachusetts and IBM Research. Subsequently, he worked for many years at IBM in Materials & Process Development of PCBs. There, he held management positions in Manufacturing Engineering, Business Development and Technology Licensing of packaging technologies. In February 2003, he joined ASE US as Director of Substrate Marketing. In 2004, Bernd moved to ASE Europe as Director of Engineering and Substrate Business Development. Starting in 2006, he moved to ASE Shanghai to lead a team of professionals in World Wide Business Development and to direct the Substrate Technology consultation efforts within ASE Materials Shanghai. At the end of 2007, Bernd returned to the US and is promoting ASE Materials substrates as Director of World Wide Business Development in Santa Clara.