Tuesday, October 12, 2010
Please register in advance for this IEEE Seminar, using our IEEE Council's DoubleKnot registration site.
||You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.|
A new era has begun to emerge, the focus of which is on 3D ICs instead of monolithic integration of heterogeneous functions. While the impact of this approach is profound, it addresses a small part of the system. What is necessary is another paradigm shift to Moore’s Law for System Integration leading to unparalleled miniaturization, functionality and cost at system level. This is the focus of this presentation with with nanoscale components for actives, passives, thermal interfaces, System interconnections, and batteries at micro and nano-scales.
He has received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE’s David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS, Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award from SME, John Jeppson's award from the American Ceramic Society as well as the Distinguished Alumni Awards from the University of lllinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received his BS from llSc, Bangalore and his Ph.D. from the University of lllinois.
Prof. Tummala has published 426 technical papers; holds 74 patents and inventions; authored the first modern packaging reference book Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and the first book introducing the System-On-Package technology. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering in the USA and in India. He has served as President of both IEEE-CPMT and the IMAPS Societies.
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