Our speaker will give a presentation on Kyocera America, Inc.'s (KAI) $5.7 million investment for their new automated flip chip subcontract assembly line. KAI has completed construction and equipment installation for this facility, located in San Diego. KAI has built a new building, 6,600 square feet, to house the flip chip assembly operation in a Class 10,000 clean room. Kyocera America, Inc. is selecting the most advanced high-placement-accuracy and units-per-hour equipment to create an initial capacity of 200,000 pieces per month with a two-shift 5-day workweek operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and some additional pieces of equipment.
A large number of flip chip substrates are also ball grid arrays; therefore this line will have full capability for advanced ball placement operations down to 0.5 mm pitch. Various ball grid array interconnect styles can be handled, such as D-BGA, C-BGA (90/10 + eutectic), and eutectic solder ball.
Due to market pressures this first assembly line will be equipped to support ceramic flip chip. Kyocera America, Inc. will accommodate various bump metallurgies and sources. It is anticipated that the majority of bump metallurgy will be high-melting-point solder such as 97/3, 95/5, & 90/10 Lead/Tin compositions. Eutectic (63/37) metallurgies are also anticipated. Kyocera America, Inc. will work with the customer's internal bump or their subcontractor's technologies. Kyocera America, Inc. will be forming strategic partnerships with those key subcontract bump providers.
Robert Lanzone is the General Manager for Flip Chip Packaging at Kyocera America. A summary of his presentation is posted on-line, for review.
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