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CPMT Technical Committee
on High Density Substrates and Boards
(TC-HDSB; was TC-6)

The High Density Substrates and Boards (HDSB) Technical Committee has the charter to identify and nurture the latest developments in HDSB on a global basis. This includes SLC (surface lamina circuitry)-like technologies, ALVIH (any-layer via interconnection), and BBIT (buried bump interconnection technology) in organic technology as well as in high-density ceramics capable of meeting 5K - 10K I/O's per chip and other innovative approaches. Our immediate goal is to solicit papers for a session at ECTC in 2004.

Associated activities:
* VLSI & GaAs Chip Packaging Workshop Symposium (U.S., Japan, Europe)
* IEEE Multichip Module Conference (MCMC)
* International Conference on Multichip Modules (ICMCM)
* International Conference on Integrated Systems in Silicon (ISIS) [was the International Conference on Wafer Scale Integration]

TC-6 Assignments

Please contact the listed individuals to get more information or to assist us.

We invite you to browse our
TC-HTSB Newsletter

Previous Newsletters (1994-1996) are posted at
TC-6 VLSI Packaging Newsletter

You can also join a Packaging Forum "ListServ" email network of technical professionals with problems and solutions in the IC packaging arena, ogranized and hosted by Binghamton University. To subscribe one must send an e-mail note to: listserv@bingvmb.cc.binghamton.edu with a message "subscribe ELPKG-L your name". You can unsubscribe in the same manner. Problems and searches for information can be posed, with the group providing responses.

For more information, or to join our TC, send an email note or letter to:

Anyone can be a participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing.

This TC has an open position for a Webmaster or assistant; please contact the chair, above.

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Last updated on || Send comments to Paul Wesling.