CPMT Members-Only Resources

CPMT SOCIETY MEMBERS-ONLY PAGE

We welcome our Members to content that has been compiled specifically for your use. Below, organized into categories, are Conference and Workshop papers, evening talk presentations, and other resources to assist you in keeping up with technology in our fields of interest.

Members will find the current UserName and Password on page 2 of the CPMT Society Newsletter, delivered to your office or home every three months. Please use the resources below, and submit additional presentations and papers that would be of interest to other members.

new! 5 talks from the Plenary Session on Advanced Flexible Circuit Board Technologies, held at ECTC in Orlando, FL USA in June 2005, and organized by the TC on High Density Substrates and Boards.

Seminars and Workshops Electronics Packaging

new! 5 talks from the Plenary Session on Advanced Flexible Circuit Board Technologies, held at ECTC in Orlando, FL USA in June 2005, and organized by the TC on High Density Substrates and Boards.
new! 9 talks from the Seminar on Packaging of Biomedical Electronic Devices, held in San Diego, CA USA in Jan 2005, and organized by the San Diego Chapter.
6 talks from the Plenary Session on High-Density Substrate Technology , held at ECTC in Las Vegas, NV USA in June 2004, and organized by the TC on High Density Substrates and Boards.
11 talks from the Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications, held in Phoenix, AZ USA in Nov 2003, and organized by the Phoenix Chapter.
Papers from the 2003 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter.
Papers from the 2003 IEEE/CPMT Symposium on Photonics Materials Reliability (PhoMat), held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter.
Papers from the 2002 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held at Stanford University in July, 2002, and organized by the Santa Clara Valley Chapter. Presentations:
new! "Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" -- Joe Adam, Skyworks Inc. (Jan. 2005)
"Alternative Packaging Technologies for 3-D Packaging" -- Joe Fjelsted, SiliconPipe. (Sept. 2004)
"Semiconductor Packaging: Substrate and Interposer Issues" -- Ron Huemoeller, AMKOR. (March 2004)
"Itanium 2 Package Development Tradeoffs" -- Kevin Haley, Intel. (February 2004)
"New Die Stacking Developments" -- Dave Tovar, OSE-USA. (October 2002)
"Emerging Packaging Challenges: The 2002 Semiconductor Packaging Roadmap" -- Joseph Adam, Conexant. (April 2002)
"Wafer Level Packaging" -- Dr. Luu Nguyen, Package Technology Group, National Semiconductor Corp. (February 2002)
"Packaging of Rambus RDRAMs" -- Bel Haba, RAMBUS. (October 2000)
"Wafer Thinning and Thru-Silicon Vias" -- John Reche, Tru-Si. (May 2000)

Electronic Materials Optoelectronics/MEMS Packaging

Presentations:
new! "Dielectric Materials for High Density Interconnect Technology" -- Masahiro Ito and Shunsuke Yokotsuka - Asahi Glass Co., Ltd. (June 2004)
new! "IVH Multi-Layer Printed Circuit Board with Polyimide Films" -- Akihito Kurosaka and Osamu Nakao - Fukikura Ltd. (June 2004)
Conferences and Workshops:
Papers from the 2003 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter.
Papers from the 2003 IEEE/CPMT Symposium on Photonics Materials Reliability (PhoMat), held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter.
Papers from the 2002 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held at Stanford University in July, 2002, and organized by the Santa Clara Valley Chapter.

Presentations:
"Illumination with LEDs", Paul Martin, Lumileds (February 2003)
new! "OLED (Organic LED) Display Technology and Applications", Homer Antoniadis, OSRAM Opto Semiconductors. (January 2004)

Thermal Modeling and Management Electronics Packaging for Biomedical

Presentations:
new! "Stablcor - a technology that controls CTE," Don Roy and Kris Vasoya, ThermalWorks. (December 2004)
new! "Thermally Conductive Printed Circuit Board Materials: The T-lam System," Dr. Richard F. Hill, Thermagon, Inc. (December 2004)
new! "An Introduction to Thermal Clad Insulated Metal Substrates," Justin Kolbe, the Bergquist Company. (December 2004)
"Hey Buddy Can you Spare a Paradigm" (Thermal Characterization), Bruce Guegin, Sun Microsystems. (March 2003)
"Micro-Bolometer Sensor and Infrared Camera Design", James Hungerford and Brad Risser, Flir Systems. (January 2002)
"Liquid Crystal Thermography -- An Effective Method for Die, Package and PCB Temperature Measurement" Dr. Keveh Azar, President and CEO of Advanced Thermal Solutions, Inc. (January 2002)
Conferences and Workshops:
new! "Packaging of Biomedical Electronic Devices" Seminar, San Diego CPMT Chapter (January 2005)
Includes:

"Design and Packaging Considerations of the Electronic Knee ('E-Knee')"
Short Video Clips of the design, surgery, and use of the Electronic Knee
"Introduction to Implantable Cardiac Devices"
"Medical Integrated Circuits"
"Medical Microelectronic Packaging"
"Introduction to Medical Materials"
"Medical Device Energy Sources - An Introduction"
"Medical Change Management"
"Reliability Test Levels and Methodologies"
"Medical Applications: Electronic Device Packaging"

Processing, Test, Manufacturing Embedded Passives and Components

Presentations:
"System-on-a-Chip: The Testing Issues and Approaches", Dr. Jacob El-Ziq. (May 2002)
"Mfg.InfoWeb - Information Web Service for Global Manufacturing", Dr. Ken Ouchi, Avidtecs. (April 2003)
"Electronics Manufacturing Services (EMS) Industry", Mike Morris, Smith Barney. (June 2003)
"Electronic Manufacturing Service Industry -- Stocks Reflect Seasonality and ... Better Times?", Keith Dunne, RBC Capital. (June 2003)

Presentations:
new! "Electrical Characterization of Thin-Film Embedded Passives", Koichiro Nakase, Daisuke Ohshima, and Hirobumi Inoue - NEC Corporation (June 2005)
"Technology for Embedded Passives and Actives in a Substrate", Masaaski Katsumata, Matsushita Electronic Components Co., Ltd. (June 2004)
"PARC's On-Chip Microcoil Demonstrates World-record Performance", Dr. Koenraad Van Schuylenbergh, Palo Alto Research Center. (November 2003)
"Superior Decoupling for High-Speed Digital Electronics with 3M Embedded Capacitor Material", Bill Balliette, Electronic Solutions Division, 3M. (November 2003)

Bonding, Electrical Performance & Interconnects RF, Microwave, MEMS, Nano

Conferences and Workshops:
new! 5 talks from the Plenary Session on Advanced Flexible Circuit Board Technologies, held at ECTC in Orlando, FL USA in June 2005.
Talks from the Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications, held in Phoenix, AZ USA in Nov 2003, and organized by the Phoenix Chapter.

Presentations:
"High Density Interconnect on Flexible Substrates", C. Q. Cui, Compass Technology Co (Hong Kong) (June 2004)
"Wire Bonding to Advanced Copper, Low-k Integrated Circuits: the Metal/Dielectric Stacks, and Materials Considerations", George Harman, Senior Scientist, National Institute of Standards and Technology (NIST). (September 2003)

Conferences and Workshops:
"Nanotechnology: Shaping The World Atom By Atom", USA Interagency Working Group on Nanoscience, Engineering and Technology, National Science and Technology Council. (1999)
"Workshop Report: Vision for Nanotechnology Research and Development in the Next Decade", USA Interagency Working Group on Nanoscience, Engineering and Technology, National Science and Technology Council. (1999)

Presentations:
new! "The Nanotechnology Frontier: Applications of Nano to Materials and Packaging" -- Dr. Anthony Laviano, Managing Director, NANOWorld (Nov. 2004)
"Wireless LAN Markets and Companies: Upcoming Opportunities", Satya Chillara, Semiconductor Sector, W. R. Hambrecht. (January 2003)

Seminars and Workshops	Electronics Packaging
new! 5 talks from the Plenary Session on Advanced Flexible Circuit Board Technologies, held at ECTC in Orlando, FL USA in June 2005, and organized by the TC on High Density Substrates and Boards. new! 9 talks from the Seminar on Packaging of Biomedical Electronic Devices, held in San Diego, CA USA in Jan 2005, and organized by the San Diego Chapter. 6 talks from the Plenary Session on High-Density Substrate Technology , held at ECTC in Las Vegas, NV USA in June 2004, and organized by the TC on High Density Substrates and Boards. 11 talks from the Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications, held in Phoenix, AZ USA in Nov 2003, and organized by the Phoenix Chapter. Papers from the 2003 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter. Papers from the 2003 IEEE/CPMT Symposium on Photonics Materials Reliability (PhoMat), held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter. Papers from the 2002 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held at Stanford University in July, 2002, and organized by the Santa Clara Valley Chapter.	Presentations: new! "Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" -- Joe Adam, Skyworks Inc. (Jan. 2005) "Alternative Packaging Technologies for 3-D Packaging" -- Joe Fjelsted, SiliconPipe. (Sept. 2004) "Semiconductor Packaging: Substrate and Interposer Issues" -- Ron Huemoeller, AMKOR. (March 2004) "Itanium 2 Package Development Tradeoffs" -- Kevin Haley, Intel. (February 2004) "New Die Stacking Developments" -- Dave Tovar, OSE-USA. (October 2002) "Emerging Packaging Challenges: The 2002 Semiconductor Packaging Roadmap" -- Joseph Adam, Conexant. (April 2002) "Wafer Level Packaging" -- Dr. Luu Nguyen, Package Technology Group, National Semiconductor Corp. (February 2002) "Packaging of Rambus RDRAMs" -- Bel Haba, RAMBUS. (October 2000) "Wafer Thinning and Thru-Silicon Vias" -- John Reche, Tru-Si. (May 2000)
Electronic Materials	Optoelectronics/MEMS Packaging
Presentations: new! "Dielectric Materials for High Density Interconnect Technology" -- Masahiro Ito and Shunsuke Yokotsuka - Asahi Glass Co., Ltd. (June 2004) new! "IVH Multi-Layer Printed Circuit Board with Polyimide Films" -- Akihito Kurosaka and Osamu Nakao - Fukikura Ltd. (June 2004)	Conferences and Workshops: Papers from the 2003 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter. Papers from the 2003 IEEE/CPMT Symposium on Photonics Materials Reliability (PhoMat), held in San Francisco in August, 2003, and organized by the Santa Clara Valley Chapter. Papers from the 2002 IEEE/CPMT Photonic Devices and Systems Packaging (PhoPack) Symposium, held at Stanford University in July, 2002, and organized by the Santa Clara Valley Chapter. Presentations: "Illumination with LEDs", Paul Martin, Lumileds (February 2003) new! "OLED (Organic LED) Display Technology and Applications", Homer Antoniadis, OSRAM Opto Semiconductors. (January 2004)
Thermal Modeling and Management	Electronics Packaging for Biomedical
Presentations: new! "Stablcor - a technology that controls CTE," Don Roy and Kris Vasoya, ThermalWorks. (December 2004) new! "Thermally Conductive Printed Circuit Board Materials: The T-lam System," Dr. Richard F. Hill, Thermagon, Inc. (December 2004) new! "An Introduction to Thermal Clad Insulated Metal Substrates," Justin Kolbe, the Bergquist Company. (December 2004) "Hey Buddy Can you Spare a Paradigm" (Thermal Characterization), Bruce Guegin, Sun Microsystems. (March 2003) "Micro-Bolometer Sensor and Infrared Camera Design", James Hungerford and Brad Risser, Flir Systems. (January 2002) "Liquid Crystal Thermography -- An Effective Method for Die, Package and PCB Temperature Measurement" Dr. Keveh Azar, President and CEO of Advanced Thermal Solutions, Inc. (January 2002)	Conferences and Workshops: new! "Packaging of Biomedical Electronic Devices" Seminar, San Diego CPMT Chapter (January 2005) Includes: "Design and Packaging Considerations of the Electronic Knee ('E-Knee')" Short Video Clips of the design, surgery, and use of the Electronic Knee "Introduction to Implantable Cardiac Devices" "Medical Integrated Circuits" "Medical Microelectronic Packaging" "Introduction to Medical Materials" "Medical Device Energy Sources - An Introduction" "Medical Change Management" "Reliability Test Levels and Methodologies" "Medical Applications: Electronic Device Packaging"
Processing, Test, Manufacturing	Embedded Passives and Components
Presentations: "System-on-a-Chip: The Testing Issues and Approaches", Dr. Jacob El-Ziq. (May 2002) "Mfg.InfoWeb - Information Web Service for Global Manufacturing", Dr. Ken Ouchi, Avidtecs. (April 2003) "Electronics Manufacturing Services (EMS) Industry", Mike Morris, Smith Barney. (June 2003) "Electronic Manufacturing Service Industry -- Stocks Reflect Seasonality and ... Better Times?", Keith Dunne, RBC Capital. (June 2003)	Presentations: new! "Electrical Characterization of Thin-Film Embedded Passives", Koichiro Nakase, Daisuke Ohshima, and Hirobumi Inoue - NEC Corporation (June 2005) "Technology for Embedded Passives and Actives in a Substrate", Masaaski Katsumata, Matsushita Electronic Components Co., Ltd. (June 2004) "PARC's On-Chip Microcoil Demonstrates World-record Performance", Dr. Koenraad Van Schuylenbergh, Palo Alto Research Center. (November 2003) "Superior Decoupling for High-Speed Digital Electronics with 3M Embedded Capacitor Material", Bill Balliette, Electronic Solutions Division, 3M. (November 2003)
Bonding, Electrical Performance & Interconnects	RF, Microwave, MEMS, Nano
Conferences and Workshops: new! 5 talks from the Plenary Session on Advanced Flexible Circuit Board Technologies, held at ECTC in Orlando, FL USA in June 2005. Talks from the Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications, held in Phoenix, AZ USA in Nov 2003, and organized by the Phoenix Chapter. Presentations: "High Density Interconnect on Flexible Substrates", C. Q. Cui, Compass Technology Co (Hong Kong) (June 2004) "Wire Bonding to Advanced Copper, Low-k Integrated Circuits: the Metal/Dielectric Stacks, and Materials Considerations", George Harman, Senior Scientist, National Institute of Standards and Technology (NIST). (September 2003)	Conferences and Workshops: "Nanotechnology: Shaping The World Atom By Atom", USA Interagency Working Group on Nanoscience, Engineering and Technology, National Science and Technology Council. (1999) "Workshop Report: Vision for Nanotechnology Research and Development in the Next Decade", USA Interagency Working Group on Nanoscience, Engineering and Technology, National Science and Technology Council. (1999) Presentations: new! "The Nanotechnology Frontier: Applications of Nano to Materials and Packaging" -- Dr. Anthony Laviano, Managing Director, NANOWorld (Nov. 2004) "Wireless LAN Markets and Companies: Upcoming Opportunities", Satya Chillara, Semiconductor Sector, W. R. Hambrecht. (January 2003)

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