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Shortcuts:
TC-Assy (was TC-3)
TC-ASTR (was TC-7)
TC-ECCC (was TC-1)
TC-Ed (was TC-19)
TC-EDMS(was TC-12)
TC-EM (was TC-4)
TC-GEMP (was TC-21)
TC-HDSB (was TC-6)
TC-M (was TC-5)
TC-MEMS
TC-NANO
TC-Opto (was TC-10)
TC-PEP (was TC-13)
TC-RF+W (was TC-16)
TC-SP (was TC-14)
TC-Test (was TC-11)
TC-Therm (was TC-9)
TC-WLP (was TC-18)
Core Technologies
  • TC-M:        Materials (was TC-5)
  • TC-ASTR:  Reliability (was TC-7)
  • C-Opto:      Fiber Optics and Photonics (was TC-10)
  • TC-Test:    Electrical Test (was TC-11)
  • TC-EDMS: Electrical Design, Modeling and Simulation (was TC-12)
  • TC-Therm: Thermal Management and Thermomechanical Design (was TC-9)
  • TC-Ed:       Education (was TC-19)

    Components and Devices

  • TC-ECCC: Electrical Contacts, Connectors, and Cable (was TC-1)

    Packaging

  • TC-Assy:    IC and Package Assembly (was TC-3)
  • TC-HDSB: High Density Substrates and Boards (was TC-6)
  • TC-MEMS: MEMS and Sensor Packaging
  • TC-NANO: Nano Packaging
  • TC-PEP:     Power Electronics Packaging (was TC-13)
  • TC-RF+W: RF and Wireless (was TC-16)
  • TC-SP:        Systems Packaging (was TC-14)
  • TC-WLP:    Wafer Level Packaging (was TC-18)

    Process and Manufacturing

  • TC-EM:     Electronics Manufacturing (was TC-4)
  • TC-GEMP:      Green Electronics, Manufacturing, and Packaging (was TC-21)

    To join a Technical Committee, please contact the Committee Chair, as listed on the TC's Home Page, above.

    For additional information on the Technical programs of the Society, or to propose a Technical Committee for a new focused area, please contact the Society's Technical Vice-President Dr. Rao Bonda.

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    Last updated on || Send comments to Paul Wesling.